The Intel STS300C LGA3647 Passive/Active Combination Heatsink (STS300C) delivers efficient heat conductivity and fast heat dissipation using both a non-moving and moving heatsink architecture.  The easy to install, server-quality heatsink comes with a top-of-the-line heatsink and fan combo engineered to lower CPU temperatures for processors that are a member of the Intel Skylake-EX and Intel Skylake-SP family.  
 

Premium-grade heatsink

The STS300C heatsink design allows for effortless outfitting in server motherboards that implement an LGA3647 CPU socket. Its 91mm x 88mm x 64mm dimensions is unobtrusive, enabling sufficient airflow when equipped in any compatible Intel server chassis.  The included fan is removable, making it easy to service for maintenance or removed for replacement when necessary.
 

The Intel STS300C passive and active combination heatsink offers simple and efficient heat dissipation for server boards outfitted with an LGA3647 CPU socket.  It is easy to install and comes at a reasonable, cost-effective price point, making it an ideal thermal management solution for entry- and mid-level servers that use Skylake-EX and Skylake-SP processors.