Startech 1.5G Metal Oxide Thermal CPU Paste Compound Tube for Heatsink
Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
- Metal-based compound containing metal oxide - Thermal conductivity of more than 1.93 W/m-K - Negligible electrical conductivity - Stable performance over a wide temperature range - 4-6 applications per tube - Resealable syringe applicator
Detailed Description
Our thermal CPU paste improves the
effectiveness of CPU coolers by thermally bonding the CPU to the
heatsink.
A high quality metallic solution that
helps to ensure maximum dissipation of heat generated by the CPU for
optimized performance and greater system stability; and is more
effective than standard silicon-based heat grease/CPU paste,
providing optimum protection against CPU heat damage.
The StarTech.com Advantage
Better thermal conductivity over
standard silicon-based compounds and negligible electrical
conductivity for effective and safe use in high performance
applications
Applications
High demand applications, such as
overclocking and high performance CPUs
Replace old or dried out thermal
paste
Warranty
Information
Warranty
2 Years
Performance
Bleed
<0.05% at
150�C/24 Hours
Evaporation
<0.001% at
150�C/24 Hours
Specific
Gravity
>1.7 at 25
�C
Thermal
Conductivity
>1.93
W/m-K at 25 �C
Thermal
Resistance
<0.120 �C-in2/W
at 25 �C
Physical
Characteristics
Color
Silver
Materials
Silicone
Compounds 50%
Carbon Compounds 30%
Metal Oxide Compounds 20%
Award One Technology
Pty Ltd
